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Fujitsu Microelectronics has announced a new mobile WiMax chipset, optimized
for mobile WiMax devices such as smart phones and PDAs. Sample shipment will
start in August 2008. The chipset includes a baseband LSI, MB86K22; an RF LSI,
MB86K52; and a power management LSI, MB39C316. These three devices are essential
to produce a competitive WiMax module. The chipset is designed to fit in the
12x12mm WiMax module. The standby current, which has a direct impact on battery
life will not exceed 0.5mA, facilitating the development of more competitive
mobile WiMax terminals.
The initial service will be provided through PC-based mobile broadband
access, with simultaneous development of portable devices, smart phones, PDAs,
portable games and navigation systems supporting the mobile WiMax technology. Page(s) 1
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