Fujitsu Microelectronics launches mobile WiMax chipsets

Bangalore

June 27, 2008

Fujitsu Microelectronics has announced a new mobile WiMax chipset optimized
for mobile WiMax devices such as smart phones and PDAs. Sample shipment will
start in August 2008. The chipset includes a baseband LSI, MB86K22; an RF LSI,
MB86K52; and a power management LSI, MB39C316. These three devices are essential
to produce a competitive WiMax module. The chipset was designed to fit in the
12x12mm WiMax module. The standby current, which has a direct impact on battery
life will not exceed 0.5mA, facilitating the development of more competitive
mobile WiMax terminals.

Next-generation mobile WiMax technology will be deployed in the US, Europe,
and Taiwan this year, and in Japan next year. The initial service will be
provided through PC-based mobile broadband access, with simultaneous development
of portable devices, smart phones, PDAs, portable games and navigation systems
supporting the mobile WiMax technology.

The mature software stacks of the chipset have been proven in the previous
generation product, and the power management schemes have been optimized at the
system level. These advantages enable mobile WiMax terminal manufacturers to
focus on designing attractive user interfaces and service-oriented applications.

“This highly integrated WiMax chipset features the low power and small form
factor essential to the development of attractive mobile WiMax terminal
products,” said Makoto Awaga, GM-Mobile Solution Business Group, Fujitsu
Microelectronics, Japan.