Intel launches 32nm chip at the Intel Developer Forum

Mumbai

September 20th, 2007

Intel Corporation President and CEO Paul Otellini has outlined new products,
chip designs and manufacturing technologies that will enable the company to
continue its quickened pace of product and technology leadership.

Speaking at the Intel Developer Forum (IDF), Otellini showed the industry's
first working chips built using 32 nanometer (nm) technology, which would begin
production in 2009.

Otellini also described the near-term advantages computer users will
experience with Intel's upcoming 45nm family of Penryn processors, which are
based on its high-k metal gate transistor technology. The first 45nm processors
will be available from Intel in November. The company also demonstrated the
next-generation chip architecture codenamed Nehalem, due out next year.

"Our strategy of alternating next generation silicon technology and a
new microprocessor architecture -- year after year -- is accelerating the pace
of innovation in the industry," said Otellini. "Customers and computer
users around the world can count on our innovation and manufacturing capability
to deliver state-of-the-art performance that rapidly becomes mainstream."

When Intel introduces Penryn in November, it will be the world's first
high-volume 45nm processor. Penryn, along with the Silverthorne family of 45nm
processors (available next year) will have the small feature size, low-power
requirements and high-performance capabilities to meet a wide variety of
computing needs from handheld Internet computers to high-end servers. Intel
plans to introduce 15 new 45nm processors by the end of the year and another 20
in the first quarter of 2008. Intel has achieved more than 750 design wins for
the Penryn processor.

"We expect our Penryn processors to provide up to a 20 percent
performance increase while improving energy efficiency," said Otellini who
also announced that Intel's 45nm processors and 65nm chipsets would use
halogen-free packaging technology beginning in 2008.

Otellini made the first public demonstration of Intel's Nehalem processor and
said the company is on track to deliver the new processor design in the second
half of the year. The Nehalem architecture will be the first Intel processor to
use the QuickPath Interconnect system architecture, which will include
integrated memory controller technology and improved communication links between
system components to significantly improve overall system performance.

Describing other advanced Intel technologies destined to come to market,
Otellini showed the world's first 300mm wafer built using next-generation 32nm
process technology. Intel plans to introduce processors built on 32nm technology
in 2009.

Intel's 32nm test chips incorporate logic and memory (static random access
memory --SRAM) to house more than 1.9 billion transistors. The 32nm process uses
the company's second-generation high-k and metal gate transistor technology.

Otellini also announced that a version of a Penryn dual-core processor
operating at 25 watts will be available on the upcoming Montevina platform,
which will include Intel's mobile WiMAX silicon. Several equipment manufacturers
are already planning to introduce Montevina-based notebook PCs starting next
year when the platform is introduced.