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Intel launches Solid State Drives

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DQC Bureau
New Update

SANTA CLARA



MARCH 21, 2007

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Intel Corporation announced its entry into solid state drives with the Intel

Z-U130 Value Solid-State Drive. Based on NAND flash memory with industry

standard USB interfaces, the Intel Z-U130 Value Solid State Drive offers

cost-effective, high-performance storage for a wide variety of computing and

embedded platforms. With advantages over hard disk drive (HDD) or removable

universal serial bus (USB) storage devices, Intel's Solid State Drives deliver

faster boot times, embedded code storage, rapid data access and low-power

storage alternatives for value PCs, routers, servers, gaming and industrial

applications.

"Solid state drive technology offers many benefits over traditional hard

disk drives including improved performance and reliability," said Randy

Wilhelm, VP and GM of Intel's NAND Products Group. "The Intel solid state

drive technology provides robust performance, while offering Intel's industry

leading quality, validation and reliability for a wide variety of embedded

applications."

The Intel Z-U130 Value Solid State Drive is the company's first solution in

the Intel Value Solid State Drive family that will offer different industry

standard interfaces and densities. The product comes in 1 Gigabyte (GB), 2GB,

4GB and 8GB densities. With fast reads of 28 megabytes (MB) per second and write

speeds of 20 MB per second, this higher performing solid state drive is a faster

storage alternative that speeds through common PC or embedded application

operations such as locating boot code, operating systems and commonly accessed

libraries.

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The drives will also be used in a variety of Intel-based computing platforms,

such as servers, emerging market notebooks and low-cost, fully featured PCs. In

addition, it will be used in Intel embedded solutions for routers and point of

sale terminals.

Intel's Z-U130 Value Solid State Drive will be distinguished from other solid

state product offerings by its extensive validation, including more than 1,000

hours of accelerated reliability testing, and is expected to meet an average

mean time between failure (MTBF) specification of five million hours. The

product can be easily integrated into original design manufacturers' designs

because of its USB 2.0 and 1.1 compliant interfaces, 2x5 USB connector and

standard single-level cell NAND in thin small outline package (TSOP) devices.

The company is also considering next-generation products that could incorporate

cost-effective multi-level cell (MLC) technology.

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