SANTA CLARA
MARCH 21, 2007
Intel Corporation announced its entry into solid state drives with the Intel
Z-U130 Value Solid-State Drive. Based on NAND flash memory with industry
standard USB interfaces, the Intel Z-U130 Value Solid State Drive offers
cost-effective, high-performance storage for a wide variety of computing and
embedded platforms. With advantages over hard disk drive (HDD) or removable
universal serial bus (USB) storage devices, Intel's Solid State Drives deliver
faster boot times, embedded code storage, rapid data access and low-power
storage alternatives for value PCs, routers, servers, gaming and industrial
applications.
"Solid state drive technology offers many benefits over traditional hard
disk drives including improved performance and reliability," said Randy
Wilhelm, VP and GM of Intel's NAND Products Group. "The Intel solid state
drive technology provides robust performance, while offering Intel's industry
leading quality, validation and reliability for a wide variety of embedded
applications."
The Intel Z-U130 Value Solid State Drive is the company's first solution in
the Intel Value Solid State Drive family that will offer different industry
standard interfaces and densities. The product comes in 1 Gigabyte (GB), 2GB,
4GB and 8GB densities. With fast reads of 28 megabytes (MB) per second and write
speeds of 20 MB per second, this higher performing solid state drive is a faster
storage alternative that speeds through common PC or embedded application
operations such as locating boot code, operating systems and commonly accessed
libraries.
The drives will also be used in a variety of Intel-based computing platforms,
such as servers, emerging market notebooks and low-cost, fully featured PCs. In
addition, it will be used in Intel embedded solutions for routers and point of
sale terminals.
Intel's Z-U130 Value Solid State Drive will be distinguished from other solid
state product offerings by its extensive validation, including more than 1,000
hours of accelerated reliability testing, and is expected to meet an average
mean time between failure (MTBF) specification of five million hours. The
product can be easily integrated into original design manufacturers' designs
because of its USB 2.0 and 1.1 compliant interfaces, 2x5 USB connector and
standard single-level cell NAND in thin small outline package (TSOP) devices.
The company is also considering next-generation products that could incorporate
cost-effective multi-level cell (MLC) technology.