subsystem to lower development costs for handset OEMs and
STMicroelectronics and Intel Corporation announced a common flash memory subsystem to lower development costs for handset OEMs and enable them to get to market faster with feature-rich phones. In an effort to simplify handset memory design, the two companies will provide hardware- and software-compatible memory products based on common specifications.
As a result, cell phone makers should see shorter development times and lower costs and will be able to
transition quickly and cost effectively to the next-generation of NOR flash products from the two companies.
NOR flash is the memory technology of choice for the volume mainstream of the cellular-phone market segment. According to industry research firm iSuppli, 92.8% of the embedded flash memory shipping in handsets is NOR flash memory.
Intel and ST provide more than 40 percent of the NOR flash memory in handsets. The move to create a 'second source' for leading NOR flash products and subsystems marks the first time that ST and Intel have worked together on common memory specifications. The first Multi-Level Cell (MLC) NOR products based on the common specifications are 512 Mbit
devices independently designed and manufactured on industry-leading 90nm process technology.
These products are now available from the two companies. The common subsystem specifications will also extend to 65nm MLC NOR technology and will focus on single-chip 1 Gb MLC NOR products. "Today, Intel and ST deliver NOR flash memory products to the top 10 handset OEMs worldwide," said Darin Billerbeck, VP and GM of Intel's Flash Products Group. "With our jointly developed memory subsystem for 90nm and 65nm NOR flash products, we will continue to build and expand on this leadership in cell phones."