TI's single-chip to enrich multimedia phones

During the 3G summit of wireless industry leaders held recently in Mumbai, Bobby
Mitra, MD, Texas Instruments Incorporated India, touched upon the new OMAP-Vox
single-chip solution designed to foster the development of low-cost
multimedia-rich feature phones. Codenamed eCosto, the new single-chip platform
is leveraging TI's innovative DRP technology, which is successful with the
LoCosto value platform in volume production.

The eCosto platform also leverages the multimedia capabilities of the OMAP-Vox
platform in volume production with the OMAPV1030 solution. The first product in
the new eCosto platform will be the OMAPV1035 single-chip solution, which will
be manufactured in 65 nanometer (nm) and will support GSM, GPRS and EDGE
standards.

The eCosto platform repre­sents the latest advancement in TI's
sophisticated and integrated DRP technology, a pioneering approach to wireless
chip design that applies digital technology to simplify radio frequency (RF)
processing in advanced CMOS process technology. Integrating the RF transceiver
and analog codec with the digital baseband significantly reduces board space,
extends battery life, and makes for a more powerful and versatile handset.

With the new OMAPV1035 single-chip solution, customers currently using TI's
LoCosto platform and OMAP-Vox processors will be able to easily expand their
handset portfolio with competitive, affordable multimedia-rich handsets.

As the current OMAPV1030 and new OMAPV1035 solutions share a common software
platform, OMAP-Vox customers will be able to re-use their application and modem
software investments for faster and more cost-effective multimedia-rich feature
phone development. Earlier TI also announced work with leading application
software providers like Sasken to further boost rapid integration of multimedia
applications into handsets.

“As the emerging markets evolve beyond voice-centric, basic multimedia
applications, we must support the integration of more advanced multimedia
features into our single-chip cell phone solutions,” said Alain Mutricy, VP
and GM-Cellular Systems Solutions (Wireless Terminals Business Unit), TI. “Now
ramping into mass production with LoCosto solutions, we are taking our DRP
single-chip technology to the next level with the eCosto platform, dramatically
lowering system costs of advanced multimedia handsets.”